MicroLED is generally interpreted as the next-generation light emitting technology. It utilizes <50 μm LED as individual pixel elements to achieve ultra-high resolution, true RGB pixels, high brightness, fast response, and power efficiency, which outperform every traditional display technology.
MicroLED's superb performances enable truly immersive visuals, breaking through some of the obstacles traditional light-emitting technologies might face.
It enables integration of MicroLED in devices from AR/VR glasses, TV, smartphone, smartwatches, HUD, etc.
Raleigh Vision pioneers advanced 3D MicroLED stacking technology enabling over 10,000 PPI. Our pixel architecture also allows for easy pixel repair.
Through improving the performances and manufacturability, cutting-edge MicroLED can be released into the market with reasonable yields and costs.
The Company’s current focus is mainly on microdisplay markets, including AR/VR, and smartwatches. We are an upstream display product developer and manufacturer, providing both standard and customized panels for its customers.
The team has unveiled their 0.38-inch Micro-LED microdisplay prototype and 0.7-inch MicroLED pixel array with pixel density over 7250 PPI, which is enabled by their groundbreaking 3.5μm large MicroLED pixel.
The Company’s stacked full-color RGB offers numerous benefits. It can achieve ultra-high 8K resolution in microdisplay, and true RGB pixels in the μLED panel enhance image sharpness and color performance.
Planar structure works well for large displays with low pixel density but struggles with high pixel density devices. Since RGB chips need separate positions on the backplane, this occupies about four times more area than stacked structures, thus limiting the ultimate pixel density.
Pixels with stacked structure can be fabricated smaller since R, G, and B chips occupy roughly the area of one μLED chip. As a result, the Company’s design enables more efficient and better-performing products compared to traditional designs.
A challenge in μLED commercialization is the high cost due to low yield. To address defective pixels, strategies include yield management, repair cost reduction, and die redundancy. Die redundancy can provide a safety factor, allowing μLED displays to operate with some defects, but it compromises pixel density.
The Company’s μLED chip design uniquely enables both redundancy and simpler repairs on the same pixel. Stacking allows redundancy to be incorporated into the μLED structure without extra illumination area. It eliminates removal or replacement during repair.
Consequently, our design offers improved manufacturability, higher production efficiency, and potentially competitive costs due to enhanced repair strategies compared to competitors.
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